| PART |
Description |
Maker |
| 21-0117G |
PACKAGEOUTLINE/2x2UCSP
PACKAGEOUTLINE/2xUCSP
PACKAGE OUTLINE, 2x2 UCSP 封装外形x2个UCSP封装
|
MAXIM - Dallas Semiconductor
DALLAS[Dallas Semiconductor]
Dallas Semiconducotr
DallasSemiconducotr
Advanced Interconnections, Corp.
|
| 21-0139A |
PACKAGEOUTLINE
|
MAXIM - Dallas Semiconductor
|
| SMP1345 |
SMP1345 Series:very Low Capacitance Plastic Packa
|
ALPHA
|
| 21-0139A |
PACKAGEOUTLINE
PACKAGE OUTLINE
|
MaximIntegratedProducts
MAXIM[Maxim Integrated Products]
|
| 21-0144B |
PACKAGE OUTLINE
PACKAGEOUTLINE
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
MaximIntegratedProducts
Maxim Integrated Products, Inc.
|
| 0674903235 67490-3235 |
1.27mm (.050") Pitch Serial ATA Header, Reverse Type, Surface Mount, Right Angle 7 Circuits, without Mylar, 0.38渭m (15渭") Gold (Au) Plating, Tape and Reel Packa
1.27mm (.050) Pitch Serial ATA Header, Reverse Type, Surface Mount, Right Angle 7 Circuits, without Mylar, 0.38μm (15μ) Gold (Au) Plating, Tape and Reel PackageLead-free
|
Molex Electronics Ltd.
|
